What if... airplane electronics could be manufactured lead-free?

Refined Manufacturing Acceleration Process (BL-NCE)

 

A Canadian-led research effort is first out of the gate with solutions that will help Canadian suppliers meet new environmental standards restricting the aerospace industry’s use of lead in electronic circuit boards. The projects, jointly funded by the Refined Manufacturing Acceleration Process (ReMAP) network and industry partners, have produced patent-pending lead-free alloys that melt at lower temperatures, minimizing the risk of “tin whiskers” which can short-circuit electronics. The low melting point also allows the metal to be reconditioned to its original properties even after 20+ years in the field. These advantages reduce the risk of field failures which may be catastrophic in high-reliability applications. Several industry consortia, including AREA Consortia, HdPug, iNEMI, CALCE and NASA, have tested and are investigating the new alloys and processes, aimed to be commercially available in time to meet the European Union’s 2019 lead-free deadline.

Complying with the European Union’s Restriction of Hazardous Substances (RoHS) directive is an important industrial priority for Celestica. The support Celestica and our project partners have received from ReMAP has accelerated the development of new lower temperature alloys that are designed to meet the aerospace industry’s high performance reliability standards. It has put Canada at the leading edge of this exciting field of materials innovation.Jeffrey Kennedy, Technology Director, Celestica Inc.