Number of partners
Director, Bromont plant – IBM Canada Ltd.
Quebec is home to Canada’s largest semiconductor wafer manufacturing facility (Teledyne DALSA) and one of the world’s most advanced packaging plants (IBM). The Université de Sherbrooke partnered with these two powerhouses to grow this regional cluster and strengthen its links to the Northeast Corridor — a major North American microelectronics industry hub stretching from East Fishkill, New York to Bromont, Quebec, that represents over 35,000 jobs. Together, they built a centre of excellence that links academic researchers with supply chain partners to move both academic and industry innovations from the prototype stage to high-volume commercial production for use in a variety of sectors, including health and environment, automotive and transportation, aerospace, energy, and communication technology.
The MiQro Innovation Collaborative Centre is the world’s most advanced microelectromechanical systems (MEMS)/wafer level packaging facility. With support from the federal and Quebec governments and its founding partners (IBM, Teledyne DALSA, the Université de Sherbrooke and the City of Bromont), C2MI opened a 15,000 sq metre state-of-the-art microelectronics facility where designers, engineers and scientists from academia and industry collaborate to transform proof-of-concepts into actual prototypes used in the manufacturing process. To help companies thrive in today’s global, knowledge-driven economy, C2MI’s ecosystem offers access to skills development, product certification, resources for market analysis and strategic business plans, intellectual property protection, financial services and guidance, and funding for commercialization.