Number of partners
Director, IBM Canada Ltd. Bromont plant
Quebec is home to Teledyne DALSA, Canada’s largest semiconductor wafer manufacturing facility, and IBM, one of the world’s most advanced packaging plants. The Université de Sherbrooke partnered with these two powerhouses to grow this regional cluster and build a centre of excellence that links academic researchers with supply chain partners to move both academic and industry innovation from the prototype stage to high-volume commercial production. These products are used in many sectors, such as health, environment, automotive, transportation, aerospace, energy and communications technology.
The MiQro Innovation Collaborative Centre (C2MI) is the world’s most advanced microelectromechanical systems (MEMS)/wafer level packaging facility. With support from the federal and Quebec governments and its founding partners (IBM, Teledyne DALSA, the Université de Sherbrooke and the City of Bromont), C2MI opened a 15,000 square metre state-of-the-art microelectronics facility where designers, engineers and scientists from academia and industry collaborate to transform proof-of-concepts into actual prototypes that enter the manufacturing process. To help companies thrive in today’s global, knowledge-driven economy, C2MI’s ecosystem offers access to skills development, product certification, resources for market analysis and strategic business plans, intellectual property protection, financial services and guidance, and funding for commercialization.